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Automatic Single Spindle Grinder
IVG-2040/3040
This fully-automatic single spindle grinder is suitable for grinding 4”-12” wafers. The machine is equipped to load and unload wafers, and it is integrated with automatic centering, cleaning, and drying functions. This machine is also equipped with an automatic thickness measurement and compensation system. It can realize automatic grinding processing of wafers from cassette to cassette, and complete dry-in and dry-out processing.
  • Maximum Wafer Size

    8 inch

  • Grinding Wheel Specification

    ?203(OD)mm

  • Grinding Wheel Spindle Power

    6.0 kw

  • Features
    Automatic system
    Automatic loading and unloading, wafer dry in and out
    Comprehensive functions
    Automatic measurement of thickness, multi-stage grinding process, and overload standby
    Good compatibility
    Suitable for a variety of semiconductor materials, suitable for 4”-12” wafer