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Wafer Scrubber
TSC-100/300S

This series comprises special cleaning equipment for wafers after CMP, with a single-station single-chamber design. These machines can integrate PVA scrubbing, mega-sonic cleaning, N2 blow drying, high-speed spin drying, and other functions with a high degree of integration, and are suitable for cleaning various semiconductor wafers after CMP.

  • Wafer Size

    2-6 inch

  • Cleaning Station

    Single-lumen single station

  • Process

    Single-sided cleaning

  • Features
    Good Compatibility
    4 to 8 inches, suitable for cleaning various materials after CMP
    Cleaning process
    Re-cleaning - Scrubbing - Mopping spray - Drying
    Type of brush
    PVA brush, single/double-side scrubbing
    PLC control system
    Touch screen operation