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Solid Wax Bonder
TWB-1150S
This is a high-precision semi-automatic solid wax chip mounter with manual chip placement, automatic wax dripping, automatic chip picking alignment & placement, and automatic air bag pressurization. It also has slide heating, hot pressing and cooling functions, resulting in uniform wax layers and outstanding wax-pasting effects.
  • Wafer Size

    2/4 inch

  • Maximum Ceramic Plate Size

    OD150 mm

  • Mode Of Operation

    Semi-automatic

  • Wax Coating

    Solid wax in a wax can for dripping

  • Features
    Pressurizing method
    Pressing plate is made of soft silicone film, the vacuum chuck table is to fix workpiece
    Semi-automatic system
    Manual loading/unloading
    Control system
    Touch screen operation, the recipe can be stored and recalled
    Auxiliary equipment
    A chiller is equipped to improve wax bonding efficiency
    Good compatibility
    Suitable for 150 ceramic block, quartz slides, etc.